Xiaomi has announced that it will unveil the Xiaomi 18 Fold and Xiaomi Pad 9 Pro Max on September 7 during its autumn flagship event in China. The event will also feature three extended-range SUVs. Both new devices will debut the in-house 3nm Xring O3 chipset, which Xiaomi claims offers improved performance and efficiency. The Xring O3 features a 10-core CPU clocked at 4.35GHz and a 16-core G2-Ultra NX GPU rated 85% faster than previous models while using 64% less power.
The Xiaomi 18 Fold has received its first official design reveal, showcasing its wide-screen foldable form factor. The device is expected to compete with other high-end foldables in the market. The Pad 9 Pro Max is also set to be a flagship tablet, likely featuring advanced specifications and performance. Xiaomi’s event will highlight its latest innovations in both hardware and software, reinforcing its position in the global tech industry.
The launch comes as Xiaomi continues to expand its product lineup with cutting-edge technology. The company’s focus on in-house chip development, such as the Xring O3, underscores its strategy to reduce reliance on external suppliers. The event is expected to draw significant attention from tech enthusiasts and industry analysts.
